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ball nut, and pinions are the highest contributors to the low stiffness of a stage Low stiffness reduces frequency response and increases settling times Maintenance and life expectancy In brushless linear servo motors, there is no contact between the two working members Therefore, they have an extremely long, virtually maintenance-free life The non-contact design eliminates lubrication and periodic adjustment to compensate for wear Rotary driven mechanisms require regular lubrication and occasional replacement due to wear Clean room and vacuum applications Since the coil assembly and the magnet assembly of linear servo motors do not make any contact, they are ideally suited for clean room and vacuum applications The main advantage of the linear servomotor is that the electromagnetic force directly engages the moving mass with no mechanical connection There is no mechanical hystersis or pitch cyclical error There are many types of linear motors, including stepper, DC brushed and brushless servo, inductance and AC Synchronous Only a few have become economically viable Brushless DC (also known as AC Synchronous) linear motors have found the widest acceptance in industrial applications because of their superior performance in precision positioning applications with a high thrust, velocity and efficiency In order to control the AC synchronous linear motor, a variable frequency power supply is used to monitor the progress of the magnet so that the coil polarity can be switched in time to accelerate the system The linear synchronous motor is reasonably efficient and quite powerful Furthermore, the coils can be positioned to optimize their effect on the magnet by predicting the acceleration of the magnet Brushed motors should not be used due to the problems associated with brush wear and heat generation at the interface Stepper motors cannot be tuned to the load or position feedback easily applied (Figure 538) This limits them to very light loads and low speeds, usually less than 20 lbs The open loop configuration also means that the stepper motor has a low servo stiffness The platen type linear motor requires a precise air gap (Figure 539) The magnet track is usually left exposed while the forces between the stator and armature are fairly high Induction motors do not use magnets.

When processing follows the process sequence 3 and 4 described earlier, tooling locations may be drilled This allows the tooling locations to be formed at the same time as the via-drill cycle To minimize distortion, which affects final registration accuracy, it is recommended that the drill program be scaled Scaling factors must be characterized through experimentation Scaling helps minimize the dimensional effect that processing has on the true positions of the holes Alternatively, extra sets of tooling holes may be produced just for the imaging process, followed by a post-etch punch operation to optimize the lamination registration..

9.1 Why Prototype 199 9.2 OK, So You Want to Prototype 9.3 Tools of the Trade 202 9.4 Steps for Prototyping 203 200

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Tooling System There are numerous rationales for innerlayer tooling schemes, and this has resulted in a wide assortment of tooling systems being used across fabricators. Over the years, many tooling systems have evolved, ranging from full-perimeter distribution of holes to as few as four holes located on the midaxis. One low-cost tooling system comprises use of rivets in a flexible layout scheme. The tooling system comprises a substantial investment and therefore merits considerable engineering conceptual judgment. Many shops become trapped with poorly conceived tooling schemes that are difficult to migrate from due to the cost of converting earlier designs.

MCP and PGA PGA packages can also be used as MCPs containing the type of substrate shown in Fig. 3.19. The PGA packages can have their cavity facing up (facing away from the PCB) or down (facing the PCB) if the package requires a heat sink for power dissipation. The pitch of the pins of the PGA is usually 0.1 in.

Multichip Stacked-Die Packages A new form of MCP is emerging at the time of this writing. The packaged dies are stacked one on top of each other and are interconnected generally by wire bonds. The dies are thinned in wafer format to thicknesses of 6 mil or less. Figure 3.20 shows the various formats. The substrates for the multichip stacked-die packages can be tape, multilayer organic (FR-4, FR-5, etc.), multilayer organic with high-density interconnect layers, or multilayer ceramic. The preferred package format is a BGA. The initial application of stacked die has been to incorporate memory with logic dies rather than integrate logic and memory on a single silicon die.

motor [16]

MCP and Known Good Die One of the issues in the application of MCP technology is the availability of known good die. Clearly considering that, for most dies, the package die test yield after wafer test runs

somewhere around 95 percent, the MCPs are limited to perhaps five IC dies per package at best. The limitation is the resultant yield loss of a finished multichip module package. As an example, for a two-die MCP where each die has an assembled yield of 90 percent the MCP yield would be 81 percent (i.e., 0.92) and for a four-chip MCP the yield would be 65.6 percent (i.e., 0.94).

System-in-a-Package An enhanced form of MCP called system-on-a-package or system-in-a-package has emerged. This package incorporates some or all of the multichip packaging technologies previously discussed. Figure 3.21 shows all of the various packaging features that make up a systemon-a-package or system-in-a-package. One feature of this package concept is that it includes not only silicon die but all the passives, etc., required to provide a system function. Passives (i.e., resistors, capacitors, and inductors) can be assembled on the substrate or can be integrated into the substrate itself (i.e., embedded passive substrate technology). Reference 11 provides a detailed overview of the system-on-a-package or system-in-a-package concept. Another example of this concept is the RF front-end HiperLAN module shown in Fig. 3.22.

10.1 At A Glance 207 10.2 Introduction 207 10.3 Design Issues: Specifying the Requirement 208 10.4 Design Description 211 10.5 Possible Alternatives 212 10.6 Code Development 213 10.7 Fabrication 217 10.8 Testing 218 10.9 Usage 219 10.10 Power Consumption 219 10.11 Adapting the Circuit to an AT90S2343 220

As the performance of semiconductors increases, as measured by clock frequency, the allowable length of interconnect that does not degrade the device performance decreases. The emergence of the Internet and the need for ever increasing bandwidth has become the

motor [16] motor [16]

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